Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Optomec Launches New 3D Additive Electronics Printer for Inline Production
January 19, 2021 | OptomecEstimated reading time: 2 minutes
Optomec is announcing a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products. The Aerosol Jet HD2, uses Optomec’s patented Aerosol Jet 3D Electronics Printing solution to produce high resolution circuitry, including a unique ability to dispense conformal 3D interconnects between die, chips, components and substrates. This interconnect approach is all the more powerful due its improved performance at high frequencies, especially for 5G and mmWave applications.
Optomec’s Aerosol Jet HD2 targets the existing $4 Billion market for back-end Semiconductor Packaging and Assembly equipment. This includes competing technologies such as wire bonding and dispensing, where shipments average 5,000 – 10,000 machines annually.
The Aerosol Jet solution works by precision jetting or “printing” an extremely fine mist of nanoparticle-based inks onto a surface. The HD2 can print features as narrow as 10 microns with placement accuracy under 5 microns. The nanoparticles are then sintered together, forming a solid metal conductor of copper, gold or silver. Insulating and adhesive materials can also be applied by the Aerosol Jet process with a variety of common IC packaging dielectric materials.
As a primary application, the Aerosol Jet HD2 can serve as a drop-in replacement for the decades-old method of connecting electrical components with wire bonds, which suffer from several critical deficiencies. First, wire bonds require high impact mechanical contact with the IC, often producing scrap, especially with fragile, next-generation gallium-based chips. Second, wire bond loops require extra space within the package, making it harder for designers to create sleek, miniature devices to meet the demands of consumer electronics. Third, wire bonds can choke off the high frequency mmWave signals required for 5G communications, automotive radar, and many other emerging applications.
“The HD2 really changes the way designers think about IC packaging.” said Bryan Germann, Aerosol Jet Product Manager. “Not only can it reduce the size of the final electronics package, but it also out-performs wire bonding when it comes to high-frequency signals. Wire bonds simply produce a lot of inductance for RF applications above 40 GHz”.
The HD2 electronics printer can also be used to print transmission lines, sensors and antennas on a wide variety of materials including common polymers, IC materials, FR4, glass, ceramic and even metals. The HD2 was designed for high volume manufacturing and includes production-friendly software that guides operators through a simplified start-up process, ensuring QA compliance. The machine is also available with an in-line conveying option for automated part loading. It can process substrates or part trays up to 300 mm wide and is available with a rotate table for 4-axis processing.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.