Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
I-Connect007 Editor's Choice: Five Must-Reads for the Week
October 16, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Trade shows and technical conferences haven’t died; they’ve just moved online. The trade show season continues in virtual full force this week, and event coverage dominates the top five this week. Surprisingly, I don’t see events as this week’s theme. No, this week’s theme is “pundits.” We have Walt Custer’s industry outlook, seven experts on additive electronics, a designers conference keynote, and the IPC’s government relations expert. Don’t get me wrong: These folks are asked to speak to the industry for a good reason. They know their subject matter, and they present it skillfully. This week’s top five picks are worth reading.
An Update on Walt Custer’s EIPC Business Outlook Webinar
Published 10/12
Once again, Pete Starkey paints pictures with the agenda of a technical conference, highlighting Walt Custer’s business outlook update, with an emphasis on the European electronics industry, from the EIPC’s webinar on October 2. It wasn’t all bad news; at one point, Custer said, “It was really bleak earlier in the year. There was nothing positive that we could say in March and April. But now, business conditions are finally improving again.”
SMTA Additive Electronics TechXchange Speakers List Announced
Published 10/12
While this online, virtual conference may have already been held on October 15, it was clear that the agenda and speaker lineup caught reader attention. The TechXchange was extremely well attended. Held in San Jose in October 2109, the first Additive Electronics Conference was a success with very engaged attendees. This year’s online version showed that a technical conference could adapt well to the online format, and attendance reflected that, with almost 4X the registered attendees over last year’s conference.
Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote
Published 10/13
Though he didn’t specifically list James Burke as an influence, something tells me that Eli Hughes, co-founder of TZero and one of the AltiumLive 2020 keynote speakers, is a fan of the classic BBC-produced television series “Connections.” Hughes’ presentation, “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” chose to highlight the gap, whereas Burke’s title concentrated on linking the knowledge, but both were after the same purpose—demonstrating that it takes cross-disciplinary thinking to truly innovate.
Electrolube Develops Plant-Based Epoxy, PU Bio Resins
Published 10/14
Electrolube has a new bio range of resins using locally sourced materials. The cost-driven incentive, led by Electrolube’s Indian and U.K. R&D teams, created a more eco-friendly plant-based isocyanate by using a local material to produce a natural oil perfect for epoxy resins.
The Government Circuit: U.S. and European Lawmakers Eyeing Changes That Would Affect Our Industry
Published 10/14
Chris Mitchell’s column tends to get a lot of reader attention. This week’s column was particularly well-read. If you haven’t caught up with it yet, his topics cover how COVID-19 is affecting the U.S. and European electronics industry, U.S. defense bills aimed at more supply chain resiliency, a pro-industrial-base COVID-19 recovery bill, and decoupling between China and the U.S.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SMT007 Magazine November 2025: Inside Mexico’s Rise as an Electronics Manufacturing Leader
11/03/2025 | I-Connect007 Editorial TeamMexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. In this issue, we uncover why Mexico is earning global recognition. From top-ranked manufacturing capabilities to expanding partnerships that reach far beyond the U.S.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.