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SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
April 18, 2024 | SEMIEstimated reading time: 1 minute
The SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.
The report outlines key aspects of the work to execute on Congress’s mandate to advance opportunity and inclusion as it brings back manufacturing and supply chains to the U.S.
“The SEMI Foundation is encouraged by the progress that has been made through the work and leadership of the CHIPS Program Office to build a more inclusive semiconductor industry,” said Shari Liss, Executive Director of the SEMI Foundation. “The focus on women-owned, veteran-owned, and minority-owned businesses, coupled with heightened awareness around the need for thoughtful workforce development and equity plans built on strong cross-sector partnerships, is shifting conversations and strategies across the industry toward the whole of society approach. These shifts toward supporting a more diverse industry workforce have the potential to not only provide economic opportunity and mobility for more Americans; they will also support a more innovative, creative, productive, and globally competitive semiconductor industry.”
“The SEMI Foundation looks forward to continuing to support CHIPS efforts to advance opportunity and inclusion and to strengthen communities across the U.S,” Liss said.
Visit SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.
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CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.