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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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iNEMI Workshop on Advanced Packaging and Its Impact on mm/Wave Applications
October 13, 2023 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI). The workshop will be hosted by ZESTRON Americas on November 7, 2023, from 9:00 a.m. to 5:00 p.m and is free for attendees.
This full-day workshop will gather industry-based and academic researchers to discuss the challenges of advanced packaging and its intersection with high-frequency (mm/Wave) materials. The morning session will focus on the latest materials and processes for electronics packaging. In contrast, the afternoon session will feature highlights from the 5G/6G mm/Wave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). This roadmap, a part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, aims to build a foundation of knowledge and expertise in the U.S. to support developing and manufacturing leading-edge 5G and 6G products.
A tour of ZESTRON’s Technical Center will be provided to attendees as well as a networking event at 2 Silos Brewing Company following the workshop. Join us for hors d'oeuvres and drinks, providing an excellent opportunity to connect with workshop speakers and fellow attendees.
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IPC / iNEMI Webinar on Circularity Challenges in Electronics Manufacturing
07/11/2024 | iNEMIJoin iNEMI and IPC to talk about a collaborative approach to the challenges of circularity in electronics manufacturing. We held a workshop with industry experts at the Electronics Goes Green conference in Berlin last month to discuss circularity challenges in electronics manufacturing.
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