-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Bowman's Micro XRF Measures Smallest Features in Wafers, Microelectronics
June 6, 2022 | BowmanEstimated reading time: 1 minute
Bowman has introduced an important addition to its suite of precision XRF instruments used in the PCB, semiconductor and microelectronics industries.
The Bowman A Series Micro XRF quickly measures the smallest features on semiconductors and microelectronics. It accommodates very large PCB panels, and wafers of any size, for full sample coverage and multi-point programmable automation.
Poly-capillary optics focus the X-ray beam to 7.5 µm FWHM, the world’s smallest for XRF coating thickness analysis. A 140X magnification camera measures features on that scale; a secondary, low magnification camera provides live-viewing of samples and “birds-eye” macro-view imaging. Bowman’s proprietary dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and quickly identify the feature of interest.
A programmable X-Y stage with movement of 23.6 in (600 mm) in each direction can handle the largest samples in the industry. The stage has precision down to +/- 1 µm for each axis, and is used to select and measure multiple points; Bowman pattern recognition software and auto-focus features also do this automatically. The system’s 3D mapping capability can be used to view the topography of ENIG, ENEPIG, EPIG and other elite processes.
A Series instruments include 7.5 µm optics with molybdenum anode tube (chromium and tungsten also available) and a high-resolution, large-window Silicon Drift Detector (SDD) which processes more than 2 million counts per second. SDDs are the standard, industry-wide, for complex thin films. The high count rate capability is key to achieving a low minimum detection limit (MDL) and highest spectral resolution.
A Series systems are distinctive in that they are cleanroom-ready, have the largest semiconductor stage movement on the market, and are supported worldwide by a service network that provides same-day response for every benchtop XRF requirement. Equipment evaluation, selection, commissioning, maintenance and modernization is available for users of Bowman instruments, as well as other major XRF brands.
Suggested Items
Teledyne's Detector Enables NASA's Europa Clipper MISE Instrument
10/21/2024 | TeledyneTeledyne Technologies Incorporated is pleased to announce its contribution to NASA's successful Europa Clipper launch, which took place at NASA's Kennedy Space Center.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
09/11/2024 | SEMIThe SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.
Teledyne FLIR Delivering Airborne Surveillance Systems to Japan Maritime Self-Defense Force Worth Up to $21 Million
09/09/2024 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, has announced that it is delivering its Star SAFIRE® 380-HLD multi-spectral imaging systems to the Japan Maritime Self-Defense Force (JMSDF) as part of an agreement worth up to $20.8 million.